HYPERCOOL: THE WATERLESS LIQUID COOLING SOLUTION FOR AI + HPC
HyperCool is a two-phase, closed-loop liquid cooling solution for the hottest processors of 2800W and beyond. It uses a direct-to-chip method — one of the most effective forms of chip cooling — to apply waterless heat transfer fluid directly to the chips to extract and disperse heat. Since no water is used in the cooling solution, equipment is fully protected from leaks, corrosion, and other water-related threats.
Key Features of L A Distributions HyperCool Solution
Waterless Direct-to-Chip Liquid Cooling Solution
Heat transfer fluid is 100% IT safe and will not damage the server even in the unlikely event of a leak.
Simple, Compact, Future Ready Data Center Solution
HyperCool supports up to and beyond 2800 watts per processor in a 1U server form factor.
100% Heat Reuse
The liquid maintains a constant temperature, therefore the heat from the servers can be harvested for heat re-use such as heating adjacent offices or inside the data center.
Low-Maintenance D2C Solution for Higher Compute Density
HyperCool increases compute density by >100kW per rack of computing power. The heat transfer fluid never needs to be replaced and does not get released into the atmosphere during server and rack maintenance.
Reduces Energy Consumption
Direct-to-chip liquid cooling technology saves up to 80% power consumption compared to air-based cooling
50% Less Space
Direct-to-chip waterless liquid cooling uses half the space of air-based and 75% less space than immersion cooling. Requires little to no data center infrastructure change and can be retrofitted on existing servers.
Benefits of L A Distributions Waterless Liquid Cooling
INCREASES PERFORMANCE & RELIABILITY
- Waterless direct-to-chip liquid cooling
- Increases compute density >100kW per rack
- Future-ready – up to 2800W and beyond
ZERO EMISSIONS DATA CENTERS
- 82% lower energy consumption compared to air
- 100% heat reuse without heat pumps
- Increased compute density reducing water & land usage
OPEX & CAPEX SAVINGS
- ROI in <2-years (instant for new AI factories)
- No chillers/CRAC required
- ~$1M saved on 2MW data center annually